Keynote Speakers


Speaker I

Prof. Guo-Quan Lu, IEEE Fellow, Virginia Polytechnic Institute and State University, USA

Biography: Dr. Guo-Quan (GQ) Lu is a professor jointly appointed between the Department of Materials Science and Engineering and the Bradley Department of Electrical and Computer Engineering at Virginia Tech. He has a double-major BS degree in Physics and MSE from Carnegie-Mellon University and Ph.D. in Applied Physics/Materials Science from Harvard University. He worked at Alcoa Technical Center from 1990 to 1992 before joining Virginia Tech. Dr. Lu teaches fundamental courses in both MSE and ECE departments. In 1995, he won a Virginia Tech Sporn award for excellence in teaching of engineering subjects and a National Science Foundation CAREER award.

Since 1998, Dr. Lu has worked extensively on research projects with colleagues in the Center for Power Electronics Systems (CPES). His research activities and interests are motivated by the needs for power electronics packaging and integration including materials for interconnect, insulation, magnetics, and substrate and assembly process technologies. He and his graduate students were early developers of three-dimensional, double-side cooled power electronics modules. In 2007, their development of nanoscale silver paste, nanoTach®, for low-temperature, pressure-less bonding of semiconductor chips was recognized with an R&D 100 award. These developments are being implemented in their research on packaging and integration of wide bandgap power devices for high-temperature and/or medium-voltage applications.

Dr. Lu is an IEEE fellow for his development of nanomaterials and packaging technologies in integration and manufacturing of power electronics modules.

 

Speaker II

Prof. Andrew Y C Nee, National University of Singapore, Singapore

Biography: Andrew Y C Nee, emeritus professor at NUS, received his PhD and DEng from Manchester and UMIST and is a pioneering leader in manufacturing research and education. Currently, he serves on 20 editorial boards of refereed journals in the field of manufacturing. He is Editor-in-Chief of Springer's longstanding International Journal of Advanced Manufacturing Technology and Executive Editor-in-Chief of Advances in Manufacturing. He has published over 500 papers in peer-reviewed international journals and conference proceedings, and has authored and edited 21 books (mostly Springer) and 30 book chapters. He has graduated 51 PhD and 47 Masters by research. He has received over 14,500 GS citations and an H-Index of 62 (August 2019) He holds honorary professorship from Tianjin, BUAA, NUAA, Shanghai, and HUST universities. He is Fellow of SME (1990), Fellow of CIRP (1990), and Fellow of Academy of Engineering Singapore (2012). In 2012, he served as the President of CIRP, the International Academy for Production Engineering. Some of the major international awards he received include: SME Gold Medal (2014), IEEE Kayamori Award (1999), IJPR Norman Dudley Award (2003), IMechE Joseph Whitworth Prize (2009), SME Outstanding Young Manufacturing Engineer Award (1982).

 

Speaker III

Prof. FU Ming Wang, The Hong Kong Polytechnic University, China

Biography: Prof Mingwang Fu (M.W. Fu) received his BEng and MEng from the Northwestern Polytechnical University, China, and PhD from the National University of Singapore. Before he went to Singapore for his career development, he had worked in China as a faculty member and conducted many projects funded by governmental agencies and industries, and was promoted to Associate and Full Professor via the fast track promotion scheme in 1992 and 1995, respectively. In 1997, he joined the Singapore Institute of Manuf. Tech. as a Senior Research Engineer. In 2006, he joined The HK Polytechnic University as a faculty member. Prof Fu’s research endeavor is more on exploring advanced materials processing, numerical modeling and simulation, product design and development, and micro-mechanics to seek an epistemological understanding of the science behind these explorations, advancing knowledge in these arenas, and successfully addressing a plethora of challenges and bottleneck issues the explorations face. Prof. Fu is sitting in the editorial board of a number of longstanding SCI journals including Int. J. of Plasticity, Mater & Design, Int. J. of Damage Mechanics, Int. J. of Adv. Manuf. Tech., and the editor of Elsevier’s Encyclopedia of Materials-Metals and Alloys. He has more than 200 papers published in SCI journals with more than half of the papers published in the top 10% SCI journals in the corresponding SCI disciplines, and published 5 monographs by the top-notched publishers including, Springer-Verlag London Ltd, CRC Press, Taylor & Francis Group, and given more than 40 keynote/plenary talks in different conferences and institutions in his research areas since 2000.

 

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