2021 International Conference on Digital Manufacturing（ICDM 2021)
Singapore (Full Virtual Style) | April 23-26, 2021
In ICDM 2021 conference, due to the COVID-19 pandemic's uncertainties in the worldwide and the pervasive travel restriction, after careful discussion, the /organizing committees decided to hold it in full virtual style as the workshop of ICMMT 2021.
In ICDM 2021, 1st day was arranged for online test and check-in for all participants. On April 24, 2021, Conference Co-Chair: Prof. FU Ming Wang, from The Hong Kong Polytechnic University, China delivered the opening remarks to welcome all participants to attend the conference. Then Prof. Guo-Quan Lu, IEEE Fellow, from Virginia Polytechnic Institute and State University, USA, Prof. Andrew Y C Nee, National University of Singapore, Singapore, etc. delivered the keynote speeches, respectively to share the latest researches in Materials Research and Manufacturing Opportunities for Power Electronics Integration, Digital Twin – Current State and Future Trends, etc.
In the conference period, there were arranged several technical sessions for authors’ presentations, such as, Materials Chemistry and Chemical Engineering, Advanced Engineering Materials and Application, etc. According to the evaluation for the authors’ presentation content, skill, etc., session chairs chose 1 best presenter in each session. At the end of the conference, Conference Chair: Prof. Vladimir Khovaylo, National University of Science and Technology, Russia announced the winners and delivered the closing remarks to end the conference.
Conference Photo Gallery
Best Presentation Awards
Presenter: Jonathan N. Patricio, University of the Philippines Diliman, Philippines
Presentation Title: Titanium Dioxide-Infused Hybrid Electrolytes Based on Ionic Liquids Containing Protic Cation: Effect of Solute Concentration on the Electrochemical and Interfacial Properties
Presenter: Ernest Yong, University of Nottingham, Malaysia
Presentation Title: Aqueous Stability of Cross-linked Thermal Responsive Tissue Engineering ScaffoldProduced by Electrospinning Technique
Presenter: Nan Sun, Chongqing Jiaotong University, China
Presentation Title: Anti-Collision Characteristics of Sandwich Structure with Space Orthogonal Concave Honeycomb